Using a narrow pulse infrared nanosecond laser, suitable forFTO、ITOZinc oxide coated glass and thin film laser etching. Equipment standard size600*600mm、600*1200mm(Simultaneously reserve a small area)300*300mmSmall format processing requirements within. Can meet10*10mmarrive300*300mmInternal processing requirements.
Equipment Introduction
The equipment adopts solid-state laser with laser wavelength1064nmSuitable for fine laser etching of conductive glass and thin films; Adopting independently developed control software and directly importing itCADLaser etching of data, simple operation, convenient and fast; The design adopts real-time adjustment of the vibrating mirror, linear motor, and electric lifting worktable through software, combined with a vacuum adsorption tray device, which can effectively solve the smoothness of laser etching processing operation; Adopting a unique dust removal system design, it can ensure the cleanliness of glass, film, and work surfaces.
The equipment integrates advanced manufacturing technologies such as CNC technology, laser technology, software technology, etc., and has the characteristics of high flexibility, high precision, and high speed. It can perform precise and high-speed etching of various patterns and sizes on a large scale, and can ensure high production capacity. It is a reliable, stable, and high-performance cost-effective product.
Applicable materials
Laser etching of thin films on glass and PET substrates, touch screens, photovoltaic solar cells, electrochromic glass, and other display screens. Can be used for conductive silver paste ITO、FTO、 Processing of conductive metals and oxide materials such as zinc oxide, zirconium oxide, titanium oxide, carbon powder, gold, silver, etc(Only applicable to laser etching of single-layer materials).
Overall description
Main components: laser, optical path system, workbench, control system Positioning system Dust extraction system Real adsorption air system, etc.
model |
ET650-NFZinc oxideITO、FTOLaser etching machine |
laser device |
Narrow pulse infrared nanosecond laser, wavelength1064nm |
Processing format |
600*600mm/1200*600mm(Customizable) |
focusing spot |
≥20μm |
Laser frequency adjustment range |
100K-500KHz |
Etching minimum line width |
≥20 um(Maximum can be removed)95%The above oxide coating) |
Precision of the whole machine |
±20μm |
Minimum line spacing |
≥20μm |
Workbench positioning accuracy |
±2um |
Workbench repeatability accuracy |
±1um |
CCDAutomatic positioning accuracy |
±2um |
etching rate |
<4000mm/s |
Equipment size |
1650mmL×1500mmW×1750mmH |
Equipment weight |
1800kg |
Power consumption |
<3000W |
Capable of handling file formats |
standardCAD DXFfile |
Note: According to the needs of the experimental stage in the early stage of the laboratory, Wuhan Yuanlu Optoelectronics has developed a small laser etching machine for the laboratory stage, which is suitable for laser etching and marking applications of conductive glass below 100 * 100mm. Welcome to consult and learn more.